Taipei, TAIPEI, Sept. 02, 2026 (GLOBE NEWSWIRE) — BIOSTAR, a leading manufacturer of edge AI computing solutions, IPC systems, industrial motherboards, graphics cards, and storage devices, is showcasing its IPC and edge AI computing solutions at LEAP 2026, taking place from August 31 to September 3, 2026, at RECC Malham, Saudi Arabia. With a strong focus on product demonstrations and real-world industrial applications, BIOSTAR is presenting an extensive lineup of industrial motherboards and EdgeComp systems built for smart manufacturing, smart cities, smart retail, and other demanding industrial computing environments. Visitors can explore BIOSTAR’s latest solutions at DeepFest Hall 5, Booth H5.C28.
BIOSTAR at Leap
BIOSTAR’s industrial motherboard showcase spans eight models: the BIW88-AHS, BIH61-AHA, BIWCL-IHT, BIPTL-IHT, BITWL-IHT, BIWCL-PAT, BIRPL-PAT, and BITWL-150. Leading the lineup are two of BIOSTAR’s newest platforms. The BIPTL-IHT carries an onboard Intel Panther Lake-H processor with DDR5-7200 SO-DIMM support up to 128GB, quad-display output across LVDS, dual HDMI and dual DisplayPort, six COM ports, and onboard TPM 2.0. Alongside it, the BIWCL-IHT for Mini ITX and BIWCL-PAT for 3.5” SBC are built on Intel’s new Wildcat Lake processors, supporting the new Intel Core platform, DDR5-6400 memory, and dual Intel i226 2.5GbE networking.
For higher-performance industrial workloads, the BIW88-AHS pairs Intel Core Ultra 200 series processors with the Intel W880 chipset, offering four DDR5-5600 U-DIMM slots with ECC support up to 192GB, quad Intel 2.5GbE, dual PCIe 5.0 x16 slots, and five additional PCIe 4.0 slots for expansion. The BIH61-AHA combines five conventional PCI slots with modern PCIe 4.0 expansion on the Intel H610 platform, supporting 12th- to 14th-Gen Intel Core processors on the LGA1700 socket. Completing the range, BIOSTAR BITWL-IHT, the Thin Mini-ITX IPC motherboard, supports Intel Alder Lake-N, Amston Lake, and Twin Lake processors with six COM ports, including two RS232/422/485 and four RS232 ports, together with a wide-range 9–24V DC input. The compact BITWL-150 brings Intel Twin Lake to space-constrained deployments, with dual 2.5GbE Intel interfaces and triple-display output.
Alongside its motherboard lineup, BIOSTAR is showcasing EdgeComp systems covering a broad range of edge deployment requirements. For harsh environments, the MS-X7433RE and MS-X6413E operate across a –40°C to 60°C range on Intel Amston Lake x7433RE and Intel Elkhart Lake x6413E processors, respectively each with dual Intel I226-IT 2.5GbE and four COM ports in a 160 x 130mm chassis. The fanless MT PRO-J6412 delivers Intel Celeron J6412 computing with six COM ports, while the fanless MS-1335U steps performance up to a 10-core Intel Core i5-1335U with up to 96GB of DDR5 memory and quad 4K display output. The MU-N150 packages Intel Twin Lake N150 with dual 2.5GbE and triple 4096 x 2160@60Hz display support into a 115 x 118 x 49mm footprint, while the MT-U335/U325 edge AI platform introduces Intel Core Ultra 300S processors to the EdgeComp line.
BIOSTAR’s edge AI systems on display at LEAP 2026 are built on NVIDIA Jetson platforms. The MS-NAT5000 and MS-NAT4000 series are powered by NVIDIA Jetson Thor T5000 and T4000 modules, delivering up to 2,070 and 1,200 TFLOPS of FP4 AI performance, respectively. The systems feature 128GB and 64GB of 256-bit LPDDR5X memory, respectively, along with dual 5GbE LAN, QSFP28 connectivity supporting multiple 25GbE links, and PCIe 5.0 x4 NVMe storage for high-bandwidth workloads. The MS-NAT5000 additionally features four CAN FD channels.
For compact edge AI deployments, the fanless MS-NANO is built on the NVIDIA Jetson Orin Nano platform with a 1024-core NVIDIA Ampere GPU and 32 Tensor Cores, offering optional PoE on both LAN ports and an operating range of –20°C to 50°C.
A live demonstration featuring the EdgeComp MT-N150-MX3 with MemryX is also on display at Booth H5.C28. The system pairs an Intel Twin Lake N150 platform with a MemryX MX3 M.2 accelerator, delivering up to 24 TFLOPS of AI computing performance with low power consumption and demonstrating how BIOSTAR integrates dedicated AI acceleration into its EdgeComp platforms.
Through its IPC and EdgeComp portfolio, BIOSTAR is addressing the growing requirements of smart manufacturing, smart cities, and smart retail. From intelligent automation and predictive analytics to monitoring and edge-based AI processing, the showcased solutions demonstrate how industrial computing platforms can support increasingly data-driven operating environments.
In addition to its main showcase at DeepFest Hall 5, BIOSTAR products are also being exhibited at the New Taipei City Pavilion in LEAP Hall 3, Booth H3.C190-10. The EdgeComp MS-X7433RE and MU-N150 are on display, representing BIOSTAR’s wide-temperature industrial computing and compact edge deployment options.
BIOSTAR invites industry professionals, partners, system integrators, and visitors attending LEAP 2026 to visit DeepFest Hall 5, Booth H5.C28, and the New Taipei City Pavilion at LEAP Hall 3, Booth H3.C190-10, to explore its latest IPC and edge AI computing solutions.
BIOSTAR Showcased at 2026 LEAP
Press Inquiries
Emily Lin
emily [at] yunlymedia.com
https://www.biostar.com.tw/app/en/
Taipei, Taiwan
